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About This Item
Empirical Formula (Hill Notation):
Cu
CAS Number:
Molecular Weight:
63.55
MDL number:
UNSPSC Code:
41141805
PubChem Substance ID:
NACRES:
NA.24
grade
certified reference material
Agency
IRMM®
manufacturer/tradename
JRC
resistivity
1.673 μΩ-cm, 20°C
bp
2567 °C (lit.)
mp
1083.4 °C (lit.)
density
8.94 g/mL at 25 °C (lit.)
format
matrix material
SMILES string
[Cu]
InChI
1S/Cu
InChI key
RYGMFSIKBFXOCR-UHFFFAOYSA-N
Application
Copper may be used as a standard reference material in studying the thermal expansion coefficient of different available grades of copper like high purity copper, tough pitch copper and oxygen-free high-conductivity copper using absolute laser interferometric dilatometer.
Analysis Note
For more information please see:
IRMM522A
IRMM522A
Legal Information
IRMM is a registered trademark of European Commission
Storage Class Code
11 - Combustible Solids
WGK
WGK 2
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
Certificates of Analysis (COA)
Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.
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