Curing condition: 250-350 °C, 20-30 min.

Hexagonal boron nitride ink (hBN) is an insulating material with properties like high thermal conductivity, excellent dimensional stability, and good mechanical robustness. hBN inks can be used in the fabrication of flexible memory devices.

We are committed to bringing you Greener Alternative Products, which adhere to one or more of The 12 Principles of Greener Chemistry. This product belongs to Enabling category of greener alternatives thus aligns with "Design for energy efficency". Boron nitride materials have interesting properties like large energy band gap, good resistance to oxidation, excellent thermal stability, thermal conductivity, chemical inertness, significance mechanical property and widespred applications. Click here for more information.

This ink was tested on polyimide and silicon dioxide substrates.

Sold under Materials Transfer Agreement with Mark Hersam group at Northwestern University.