767506
Titanium
sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.995% trace metals basis
Sign Into View Organizational & Contract Pricing
All Photos(1)
About This Item
Empirical Formula (Hill Notation):
Ti
CAS Number:
Molecular Weight:
47.87
EC Number:
MDL number:
UNSPSC Code:
12352103
PubChem Substance ID:
NACRES:
NA.23
Recommended Products
Quality Level
Assay
99.995% trace metals basis
form
solid
autoignition temp.
860 °F
reaction suitability
core: titanium
resistivity
42.0 μΩ-cm, 20°C
diam. × thickness
2.00 in. × 0.25 in.
bp
3287 °C (lit.)
mp
1660 °C (lit.)
density
4.5 g/mL at 25 °C (lit.)
SMILES string
[Ti]
InChI
1S/Ti
InChI key
RTAQQCXQSZGOHL-UHFFFAOYSA-N
Related Categories
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
Storage Class Code
11 - Combustible Solids
WGK
nwg
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
Choose from one of the most recent versions:
Already Own This Product?
Find documentation for the products that you have recently purchased in the Document Library.
Our team of scientists has experience in all areas of research including Life Science, Material Science, Chemical Synthesis, Chromatography, Analytical and many others.
Contact Technical Service