767484

Nickel

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

• 실험식(Hill 표기법): Ni
• CAS Number: 7440-02-0
• Molecular Weight: 58.69
• EC Number: 231-111-4
• MDL number: MFCD00011137
• UNSPSC 코드: 11101706
• PubChem Substance ID: 329767317
• NACRES: NA.23

속성

• Quality Level: 100
• 분석: 99.95% trace metals basis
• 양식: solid
• 반응 적합성: core: nickel
• 저항도: 6.97 μΩ-cm, 20°C
• 직경 × 두께: 2.00 in. × 0.25 in.
• bp: 2732 °C (lit.)
• mp: 1453 °C (lit.)
• density: 8.9 g/mL at 25 °C (lit.)
• SMILES string: [Ni]
• InChI: 1S/Ni
• InChI key: PXHVJJICTQNCMI-UHFFFAOYSA-N

설명

애플리케이션

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

안전성 정보

• 픽토그램: GHS08,GHS07
• 신호어: Danger
• 유해 및 위험 성명서: H317,H351,H372
• 예방조치 성명서: P202 - P260 - P264 - P280 - P302 + P352 - P308 + P313
• Hazard Classifications: Carc. 2 - Skin Sens. 1 - STOT RE 1
• Storage Class Code: 6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects
• WGK: WGK 2
• Flash Point (°F): Not applicable
• Flash Point (°C): Not applicable